The aim was to improve the interfacial bond between microcapsules and epoxy matrix in composites through the epoxy functional group in KH560. The microcapsulating mechanism was discussed and the process was explained. The morphology and shell wall thickness of microcapsules were observed by using scanning electron microscopy. The size of microcapsules was measured using
optical microscope and the size distribution was investigated based on data sets of at least 200 measurements. The chemical structure and thermal properties of microcapsules were characterized by Fourier transform infrared spectroscopy, X-ray photoelectron spectra, and thermogravimetric analysis. Results indicted that the PUF-graft ISRIB inhibitor KH560 microcapsules containing DCPD can be synthesized successfully; the epoxy functional group was grafted on the wall material. The microcapsule size is in the range of 40-190 mu m with an average of 125 mu m. The wall this website thickness of microcapsules sample is in the range of 2-5 mu m and the core content of microcapsules is about 60%. (C) 2009 Wiley Periodicals, Inc. J Appl Polym Sci 113: 1501-1506, 2009″
“Creep tests were conducted
on a nanocrystalline Cu at room temperature. The results at very low strain rates (<4 x 10(-8) s(-1)) are consistent with Coble creep. An overall view of stress-strain rate behavior of this nanocrystalline Cu indicates that as the strain rate decreases, the deformation
mechanism transition from predominantly dislocation activity to diffusion Coble creep, as evidenced by the strain rate sensitivity on stress trending to m=1 and activation volume trending to v=1.5b(3). The typical strain rate https://www.sellecn.cn/products/ABT-263.html sensitivity of m=0.5 for surperplasticity can hardly be obtained at such low homogenous temperature. (C) 2009 American Institute of Physics. [doi:10.1063/1.3247583]“
“The surface treatment of spherical silica particles with a silane coupling agent with mercapto groups was carried out. The treated silica particles were incorporated within polyisoprene and then vulcanized. The effects of the loading amount and alkoxy group number of silane on the stress-strain curve of the filled composite were investigated. For this purpose, silanes with dialkoxy and trialkoxy structures were used. The loading amount of silane on the silica surface was varied from 1 to 8 times the amount required for monolayer coverage. The stress at the same strain increased with the silane treatment, and it was higher in the dialkoxy structure than in the trialkoxy structure above 300% strain. There was no significant influence of the loading amount on the stress for the trialkoxy silane structure.